Own the electrical and mechanical package design of advanced packages for high-speed optical interconnect and networking products, from concept and floorplanning through design release to manufacturing. Design advanced package architectures including FCBGA/FCCSP, organic substrates, silicon interposers, and 2.5D/3D integration supporting Co-Packaged Optics (CPO), Optical I/O, and pluggable optical modules. Develop high-density substrate routing and controlled-impedance interconnect for 112G, 224G, and 400G electrical interfaces, optimizing signal and power integrity across the package. Perform transmission line design, differential pair routing, via optimization, and return-current-path management to meet stringent high-speed performance targets. Define package stack-ups, design rules, and layout guidelines in partnership with signal integrity, power integrity, and thermal teams to meet electrical, thermal, and mechanical requirements. Address package reliability early in design, accounting for warpage, thermo-mechanical stress, underfill selection, and solder joint reliability through design and simulation trade-offs. Collaborate with silicon photonics, optical, and assembly teams on light coupling, fiber attach, and optical alignment considerations that impact package design. Drive design reviews, tolerance analyses, and design-for-manufacturability and design-for-assembly assessments with substrate vendors, OSATs, and internal manufacturing teams. Support package prototyping, bring-up, and qualification, resolving design issues and feeding lessons learned back into design rules and next-generation architectures.

Desired Candidate Profile

• MS or PhD in Electrical Engineering, Mechanical Engineering, Packaging Engineering, or related discipline (BS with extensive experience considered).
• 10+ years of experience in semiconductor package design.
• Proven experience designing advanced packages for high-speed networking, datacenter, or optical products.
• Strong knowledge of:
• FCBGA/FCCSP technologies
• Organic substrates
• Silicon interposers
• 2.5D/3D packaging
• Flip-chip assembly
• High-density substrate routing
• Experience designing packages supporting 112G, 224G, and preferably 400G electrical interfaces.
• Understanding of transmission line design, controlled impedance routing, differential pair design, via optimization, and return current paths.
• Familiarity with package reliability considerations including warpage, thermo-mechanical stress, underfill, and solder joint reliability.
• Experience working with substrate vendors and manufacturing teams.
• Strong communication and cross-functional leadership skills.